| Processor |
NXP i.MX6Quad with quad 1 GHz/800 MHz ARM Cortex-A9 cores |
| Memory |
2 GByte DDR3L 1066 MT/s, 64-bit databus
4 GByte eMMC NAND Flash for OS and bootloader |
| Graphics outputs |
Up to four display interfaces can be used simultaneous;
• Dual LVDS: 18/24 bit, up to 85 Mpixels/sec, for example WXGA (1366 x 768 px) at 60 Hz
• Parallel RGB: 24-bit up to WXGA (1366 x 768 px) at 60 Hz
• MIPI-DSI: 2 lanes
• HDMI 1.4 port: up to 1920 x 1080 px |
| Graphics inputs |
CMOS sensor interface (camera), parallel interface,
and serial interface: MIPI-CSI2, 4 lanes |
| Graphics engines |
• GPU 3D/2D (GC2000/GC355/GC320) supporting OpenGL ES 3.0, OpenVG 1.1 APIs
• HW video decoder: 1080p60h H.264 HP
• HW video encoder: 1080p30h H.264 BP / Dual 720p |
| Ethernet |
10/100/1000 Mbps Gigabit Ethernet interface with on-board Ethernet-PHY |
| I/O |
i.MX6Quad peripherals (see i.MX6Quad datasheet for details about peripherals):
• PCIe; 1x lane, v2.0
• SATA; 1x SATA II
• USB; 1x USB 2.0, 1x USB 2.0 OTG
• Audio; up to 4 I2S/AC97 ports
• SPDIF; 1 channel
• SDIO; 3x MMC/SD/SDIO
• Serial Port; 5x UART
• SPI; 5x eCSPI
• CAN; 2x CAN bus 2.0B
• I2C; 3x channels
• PWM; 4x channels
See iMX6Quad COM Board Datasheet for details about available pins/peripherals. |
| Mechanical |
82 x 50 mm (W x D), SMARC form factor but different pinning for better carrier board routing |
| Power |
+3.3V power supply voltage
Power consumption: TBD |
| Connectors |
314 pos MXM3 edge connector, 0.5mm pitch
10 pos 0.5mm pitch FPC for JTAG |
| Environment |
Operating Temperature: 0 - 60 degrees Celsius (standard) or -40 to +85 degrees Celsius (on request)
Operating Humidity: 5 - 90% relative humidity, non-condensing |
| Other |
• i.MX6Quad on-chip RTC
• On-board watchdog functionality
• Integrated power managment with PMIC (PF0100) supporting DVFS techniques for low power modes |
Product Classification
and Status |
Integration board; In Development/Sampling |
